BE Semiconductor Industries N.V.
Climate Impact & Sustainability Data (2024-04-01 to 2024-06-30)
Reporting Period: 2024-04-01 to 2024-06-30
Environmental Metrics
Climate Goals & Targets
Environmental Challenges
- Continued weakness in smartphone end markets
- Ongoing weakness in automotive end markets
- Elevated post-pandemic inventory levels at semiconductor producers
- Extended assembly downturn
Mitigation Strategies
- Increased R&D spending in support of wafer level assembly activities
- Development of next generation hybrid bonding targeting sub-100 nm placement accuracy
- Build out of Besi’s hybrid bonding and TCB capabilities
- Enhancements to current product portfolio