Climate Change Data

Pragmatic Semiconductor

Climate Impact & Sustainability Data (2023)

Reporting Period: 2023

Environmental Metrics

Total Carbon Emissions:Not disclosed
Scope 1 Emissions:Not disclosed
Scope 2 Emissions:Not disclosed
Scope 3 Emissions:Not disclosed
Renewable Energy Share:Not disclosed
Total Energy Consumption:Less than 0.04 MWh per wafer for FlexICs; 1.35 MWh/wafer for TSMC (average)
Water Consumption:Less than 32 litres/wafer for FlexICs; 5,840 litres/wafer for TSMC
Waste Generated:Not disclosed
Carbon Intensity:Not disclosed

ESG Focus Areas

  • Climate Change
  • Environmental Sustainability
  • Resource Efficiency

Environmental Achievements

  • Reduced CO2e emissions by more than 300 times compared to a typical silicon MCU.
  • Reduced energy consumption by more than 33 times compared to silicon wafer production.
  • Reduced water consumption by more than 100 times compared to silicon manufacture.

Social Achievements

  • Not disclosed

Governance Achievements

  • Not disclosed

Climate Goals & Targets

Long-term Goals:
  • Not disclosed
Medium-term Goals:
  • Not disclosed
Short-term Goals:
  • Not disclosed

Environmental Challenges

  • Limited performance compared to high-end silicon chips.
  • Difficulty in obtaining detailed process-level environmental data for silicon production.
Mitigation Strategies
  • Ongoing process improvements to sensorisation and localised wastewater treatment and recovery.
  • Using abatement system to decompose CF4 into less harmful substances.

Supply Chain Management

Supplier Audits: Not disclosed

Responsible Procurement
  • Not disclosed

Climate-Related Risks & Opportunities

Physical Risks
  • Not disclosed
Transition Risks
  • Not disclosed
Opportunities
  • Not disclosed

Reporting Standards

Frameworks Used: Null

Certifications: Null

Third-party Assurance: Not disclosed

UN Sustainable Development Goals

  • Not disclosed

Not disclosed

Sustainable Products & Innovation

  • FlexICs

Awards & Recognition

  • Not disclosed