Renesas Electronics Corporation
Climate Impact & Sustainability Data (2007, 2007-04 to 2008-03, 2009, 2014, 2015-04 to 2016-03, 2018-06-25, 2021, 2022-09)
Reporting Period: 2007
Environmental Metrics
ESG Focus Areas
- Corporate Social Responsibility (CSR)
- Corporate Governance
- Environmental Protection
- Community Involvement
- Ethical Business Practices
- Customer Focus
- Corporate Culture
Environmental Achievements
- Participation in Kanagawa Water-Source Forest Creation Project
- Incorporation of environmental considerations into the entire product life cycle
Social Achievements
- Established NEC Electronics Guiding Principles to promote management guidelines for CSR
- Family-friendly workplace initiatives
- Electronic industrial arts class for local elementary school students
- CSR Guidelines issued for purchasing partners
- Regular top executive meetings with sales partner companies
Governance Achievements
- Adopted the corporate auditor system
- Introduced the Corporate Officer System
- Established a Corporate Social Responsibility Promotion Committee
- Adopted NEC Electronics Guiding Principles and NEC Electronics Group Code of Conduct
Climate Goals & Targets
- In the fiscal year ending March 31, 2010, sales and profit growth that outpaces the market
- Achieve “EIGYO profit” in the fiscal year ending March 31, 2008
Environmental Challenges
- Growth in the semiconductor market began to taper off
- Price declines for main products due to intensified competitive pressures
- Increased R&D expenses
- One-time expenses for structural reforms
- Sharp falls in LCD driver IC prices
Mitigation Strategies
- New management policy with measures for achieving a recovery in business performance (improving R&D efficiency, increasing sales by concentrating product development resources, lowering manufacturing costs, restructuring the organization)
- Cutting fixed costs by ¥20 billion
- Streamlining product lines and executing a more product-centered manufacturing operation
- Constructing manufacturing process lines dedicated to LCD drivers
Supply Chain Management
Responsible Procurement
- CSR Guidelines for purchasing partners
Climate-Related Risks & Opportunities
Sustainable Products & Innovation
- Eco-products incorporating environmental considerations
Reporting Period: 2007-04 to 2008-03
Environmental Metrics
ESG Focus Areas
- Not disclosed
Environmental Achievements
- Not disclosed
Social Achievements
- Not disclosed
Governance Achievements
- Not disclosed
Climate Goals & Targets
- Not disclosed
- Not disclosed
- Not disclosed
Environmental Challenges
- Rapid rise of the yen impacting profitability due to high yen-based costs and fluctuating exchange rates.
- Balancing strong production with improved breakeven point control through centralized development resources.
- Expanding overseas sales ratio, particularly in the rapidly growing Chinese and Asian markets.
Mitigation Strategies
- Accelerating procurement of materials in foreign currency and transitioning semiconductor test and assembly bases overseas.
- Consolidating production lines and improving production efficiency.
- Controlling the ratio of R&D costs to sales, producing strongly competitive products, and focusing development resources on products with promise in competitiveness and growth.
- Expanding sales base infrastructure in Chinese and Asian markets, increasing engineering staff to support local customers, and strengthening product development in line with local demand.
Supply Chain Management
Supplier Audits: Not disclosed
Responsible Procurement
- Not disclosed
Climate-Related Risks & Opportunities
Physical Risks
- Not disclosed
Transition Risks
- Not disclosed
Opportunities
- Not disclosed
Reporting Standards
Frameworks Used: U.S. GAAP
Certifications: Null
Third-party Assurance: Ernst & Young Shin Nihon
UN Sustainable Development Goals
- Not disclosed
Not disclosed
Sustainable Products & Innovation
- NaviEngine (multicore car navigation LSI), CE131 (8-megapixel image signal processor), 32-bit microcontrollers with low power consumption.
Awards & Recognition
- Not disclosed
Reporting Period: 2009
Environmental Metrics
ESG Focus Areas
- Environmental Protection
- Ethical Business Practices
- Community Involvement
- Corporate Culture
Environmental Achievements
- All NEC Electronics Group companies have acquired ISO 14001 certification
Social Achievements
- Participation in the United Nations Global Compact
- Various community involvement activities (water-source forest protection, electronic industrial arts class for elementary school students, volunteer work at a local child-care home)
- Family-friendly workplace initiatives
Governance Achievements
- Adopted the corporate auditor system
- Introduced the Corporate Officer System to clarify responsibilities
Climate Goals & Targets
- Restore “EIGYO profit” for the fiscal year ending March 2010
Environmental Challenges
- Severe economic downturn worldwide impacting semiconductor market demand
- Loss provision related to pending legal issues
- Expenses from closing manufacturing and R&D lines in Japan
Mitigation Strategies
- Accelerating structural reforms (realignment of manufacturing structures, enhanced R&D efficiency, cost reduction measures)
- Closing of manufacturing and R&D lines
- Reducing fixed costs, aiming to restore “EIGYO profit”
Supply Chain Management
Responsible Procurement
- CSR Guidelines issued on website specifying tasks for purchasing partners
Climate-Related Risks & Opportunities
Reporting Standards
Frameworks Used: ISO 14001, ISO/TS16949, UN Global Compact
Certifications: ISO 9001, ISO 14001, ISO/TS16949
Sustainable Products & Innovation
- Eco-microcontrollers
- Embedded DRAM LSIs with low power consumption
- Discrete semiconductors for power supply controllers
- 4-channel LED driver ICs
Reporting Period: 2014
Environmental Metrics
Climate Goals & Targets
Supply Chain Management
Climate-Related Risks & Opportunities
Reporting Period: 2015-04 to 2016-03
Environmental Metrics
ESG Focus Areas
- Environmental
- Social
- Governance
Environmental Achievements
- Reduced sales energy intensity by 27% compared to the base year.
- Reduced PFC emissions to below the previous year's level (per wafer area unit).
- Achieved a 42.1% recycling rate for water.
Social Achievements
- Continued environmental social contribution activities.
- Implemented environmental e-learning with a 98.4% completion rate.
- Awarded as an excellent business for energy saving in the "Summer Eco-Style Challenge" by Yamagata Prefecture.
Governance Achievements
- Optimized environmental management system and streamlined certification.
- Received unified domestic certification.
- Complied with various domestic and international regulations.
Climate Goals & Targets
- Reduce sales energy intensity by 1% annually until 2020, aiming for a 7.73% reduction from the 2012 level.
- Reduce sales energy intensity by 4% or more compared to the base year.
Environmental Challenges
- High energy consumption in cleanrooms due to the use of high-tech equipment.
- Significant environmental burden from production activities, including chemical material usage and waste generation.
- Continued need for energy reduction due to projected power supply shortages.
Mitigation Strategies
- Introduction of energy-saving equipment, improved material usage efficiency, and installation of harmless disposal equipment in group factories.
- Implementation of stricter internal standards for emissions than legal requirements.
- Active promotion of energy-saving measures, including LED lighting, inverter control of air conditioners and pumps, and replacement of energy-efficient refrigerators and boilers.
Supply Chain Management
Responsible Procurement
- Green procurement prioritizing suppliers with strong environmental performance and non-hazardous materials.
Climate-Related Risks & Opportunities
Reporting Standards
Frameworks Used: Environmental Report Guidelines 2012 (Ministry of the Environment, Japan), Environmental Accounting Guidelines 2005 (Ministry of the Environment, Japan), ISO 26000:2010 (Social Responsibility)
Certifications: ISO 14001
Awards & Recognition
- Excellent business award in Yamagata Prefecture's "Summer Eco-Style Challenge"
Reporting Period: 2018-06-25
Environmental Metrics
ESG Focus Areas
- Not disclosed
Environmental Achievements
- Not disclosed
Social Achievements
- Not disclosed
Governance Achievements
- Not disclosed
Climate Goals & Targets
- Not disclosed
- Not disclosed
- Not disclosed
Environmental Challenges
- Not disclosed
Mitigation Strategies
- Not disclosed
Supply Chain Management
Supplier Audits: Not disclosed
Responsible Procurement
- Not disclosed
Climate-Related Risks & Opportunities
Physical Risks
- Not disclosed
Transition Risks
- Not disclosed
Opportunities
- Not disclosed
Reporting Standards
Frameworks Used: Null
Certifications: Null
Third-party Assurance: Not disclosed
UN Sustainable Development Goals
- Not disclosed
Not disclosed
Sustainable Products & Innovation
- Not disclosed
Awards & Recognition
- Not disclosed
Reporting Period: 2021
Environmental Metrics
ESG Focus Areas
- Environment
- Social
- Governance
Environmental Achievements
- Issued Green Bonds for US$1.35 billion for environmentally beneficial projects
- Improved ESG ratings from international research organizations (MSCI, Inc., FTSE, etc.) and inclusion in indexes such as the MSCI Japan Empowering Women Index (WIN).
Social Achievements
- Implemented Renesas Culture guideline of "Transparent, Agile, Global, Innovative, Entrepreneurial" (TAGIE) with initiatives like CEO roundtables, an in-house portal, and employee surveys.
- Introduced an in-house free agent system to optimize employee portfolio and enhance HR development.
- Promoted domestic and overseas social contribution activities.
Governance Achievements
- Strengthened governance with focus on the Board of Directors.
- Improved information disclosure through the Group's website.
- Established a voluntary Compensation Committee dominated by Outside Officers and chaired by an Outside Director.
Climate Goals & Targets
Environmental Challenges
- Supply disruptions due to increased demand, inflation, and labor shortages.
- Supply constraints in the semiconductor market due to natural disasters and the Covid-19 pandemic.
- Geopolitical issues, particularly prolonged trade friction between the U.S. and China.
- Challenges in aligning production with order lead times and business practices related to order finalization in the supply chain.
- Need to strengthen software development capabilities.
Mitigation Strategies
- Implemented logistics realignment measures to control costs.
- Strategic investment in integrating the ERP system to improve efficiency.
- Expanding production volumes at contract manufacturers and expanding facilities at its own plants.
- Strengthening disaster prevention measures, including expanding firefighting facilities and predictive maintenance systems.
- Strengthening software development and customer support systems by promoting internal development efficiency and leveraging outsourcing.
- Decentralizing design bases worldwide and optimizing resources.
- Acquisitions (Dialog and Celeno) to expand product portfolio and technologies.
- Improvements to supply chain structure and IT systems, establishment of chip stocks, review of business terms and conditions, and optimization of sales channels.
Supply Chain Management
Climate-Related Risks & Opportunities
Sustainable Products & Innovation
- RH850/U2B microcontroller
- R-Car S4 gateway SoC
- PMICs for automotive central computers
- 5G Beam Forming ICs
- 2 millimeter-wave device
- ZMOD4510 outdoor air quality sensor platform with ozone detection firmware
Reporting Period: 2022-09
Environmental Metrics
ESG Focus Areas
- Environmental
Environmental Achievements
- Developed MCUs for Battery Management Systems (BMS) achieving 60-65% reduction in power consumption compared to competitor products.
- Developed IGBT technology reducing switching loss by 20% and conductive loss by 10%, reducing overall system-level loss by 15%.
- Developed radar MMIC reducing power consumption by 67% compared to current SiGe processes, and by 40% compared to larger scale RFCMOS processes.
- Developed processor technologies for automotive SoCs achieving best-in-class power efficiency of 13.8 TOPS/W.
- R-Car solutions improve CNN performance efficiency by 20%, and PMIC solutions reduce power loss by up to 33%.
- Developed model-based design technique to reduce power consumption of on-vehicle LSIs, optimizing dedicated circuits for image recognition processing.
- DDR5 memory interface chips improve bandwidth power efficiency by 16%.
- Introduced I3C intelligent switch devices reducing complexity of high-performance system designs and offering very low power.
- 5G beamformer IC family with 33% lower power consumption, leading to 8.4Kt of reduced/avoided GHG per year.
- 8th generation IGBTs reducing power loss by more than 30% and increasing energy efficiency.
- AI technology for factories achieving the same processing power as high-end AI chips using only a few watts of electricity.
- RZ/V MPU series reducing power consumption by 80% compared to previous generations.
- RL78, RX, and RA MCUs achieving 30% less electricity consumption compared to past products.
- Developed circuit technologies for an embedded STT-MRAM test chip achieving 5.9-nanosecond random read access and a write throughput of 5.8-megabyte-per-second.
- Developed 2.4 GHz RF transceiver technologies supporting Bluetooth® Low Energy with power consumption of 3.6 mW and 4.1 mW during reception and transmission respectively.
Climate Goals & Targets
Supply Chain Management
Climate-Related Risks & Opportunities
Reporting Standards
Frameworks Used: ICMA Green Bond Principles 2021
Third-party Assurance: Sustainalytics
Sustainable Products & Innovation
- xEV Inverter Reference Solutions
- RH850/U2B MCUs
- IGBT technology
- AUTOSAR-compliant complex device driver (CDD) software module
- R-Car V3H SoC
- DDR4 and DDR5 registered clock drivers (RCDs)
- I3C intelligent switch devices
- 5G beamformer IC family (F5288 and F5268)
- 8th generation IGBTs
- AI technology for factories
- RZ/V MPU series
- RL78, RX, and RA MCUs
- HS4XXX family of relative humidity and temperature sensors
- ZSSC3281 sensor signal conditioning (SSC) IC
- embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM)
- 2.4 GHz RF transceiver technologies
Awards & Recognition
- Outstanding Business Operator Award at the 2021 NEDO Energy Conservation Technology Development Award