FormFactor Inc.
Climate Impact & Sustainability Data (2014)
Reporting Period: 2014
Environmental Metrics
Climate Goals & Targets
Environmental Challenges
- Damage to fine-pitch Cu pillars with solder caps during wafer probing due to reduced diameter and increased susceptibility to damage.
Mitigation Strategies
- Reducing probe force to control probe mark size, optimizing probe tip materials and geometry for stable contact resistance, and optimizing probe tip geometry and material to minimize wear and extend probe card lifetimes.